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Segmented MPP Film With Diamond Pattern, T Pattern, 1/2 Pattern

After the partial breakdown of the film dielectric, the metalized film has a self-healing function that causes it to naturally revert to the electrical performance phenomenon before the breakdown. The metalized film is covered on one or both sides of the edge or in the center to create a blank insulating strip without evaporating metal, known as the margin, and its width is referred to as the margin in the actual fabrication of capacitors. The same city also uses sheet resistance to denote the thickness of the metal layer and is used to describe the resistance of the metal layer on the metalized film in the unit square area. According to customer requirements, safety films can be made in a variety of parameters.

Specification of Segmented MPP Film With Diamond Pattern, T Pattern, 1/2 Pattern


Base film

Polypropylene film

Normal thickness

2.0μm ~12.0μm

Margin type

Single

Coating metal

Aluminum or Zinc-Aluminum alloy

Coating side

Single

Edge structure

Heavy edge


Square resistance: Normal film Width and Margin

Diamond Pattern

T-Pattern

1/2 T-Pattern

Width (mm)

Width (mm)

Width (mm)

Width (mm)

25

60

30

37.5

30

75

37.5


35

85

50


37.5

90

75


40

100



45

120



50





Reinforced resistance

Normal resistance

(2~4)Ω/□

(6~9)Ω/□

(1~3)Ω/□

(4~6)Ω/□

(1~3)Ω/□

(12~18)Ω/□

(2~4)Ω/□

(17~23)Ω/□

Note: If a customer needs other resistance, film width, or margin, please contact us.


Inside/outside core diameter:

Inside core diameter/Tolerance

Outside core diameter/Tolerance

75mm

+1/-0.5mm

175

220

280

320

±25mm

±20mm

±20mm

±20mm

Note: A pair tolerance of outside core diameter ≤2mm.


Specifications of metalized polypropylene film:

Properties

Unit

Typical value

Density

g/cm3

0.905±0.005

Thickness

µm

2.0 ~ 12

Tensile Strength

MD (MPa)

≥100

Elongation at Break

MD (%)

20~200

Elastic Modulus

MD (MPa)

2800

Heat Shrinkage

MD (%)

≤5 ( 120°C, 10min)

Wetting Tension

mN/m

38 (Corona treated side)

Surface Roughness

µm

0.08

Melting Point

172

Volume Resistivity

Ω.m

>1015

Break-down Voltage

V/µm

≥350 ( 23°C, DC )

Dielectric Constant


2.2 (20℃,1KHz)

Dissipation Factor


≤4×10-4 (20℃,1KHz )

RC

ΩF

≥5×104


Products

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